STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management.
To optimize thermal performance, ensure good thermal coupling between the device and the PCB, use a thermal pad or heat sink, and follow the recommended PCB layout guidelines. Additionally, reduce the thermal resistance by using thermal vias and thermal layers in the PCB.
The maximum allowed voltage on the VCC pin is 5.5V, as specified in the datasheet. Exceeding this voltage may damage the device.
Follow the recommended power-up and power-down sequences outlined in the datasheet to ensure proper device operation and prevent damage. Typically, this involves powering up the VCC pin before the VIN pin, and powering down the VIN pin before the VCC pin.
The TDE1708DFT has built-in ESD protection, but it's still recommended to follow proper ESD handling and storage procedures to prevent damage. Use ESD-safe materials, handle the device by the body, and avoid touching the pins.
TDE1708DFT datasheet
by STMicroelectronics
