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    Part Img TEA1521P/N2,112 datasheet by NXP Semiconductors

    • SMPS ICs for low-power systems; Package: SOT97-1 (DIP8); Container: Tube
    • Original
    • Yes
    • Obsolete
    • 8542.31.00.01
    • 8542.31.00.00
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    TEA1521P/N2,112 datasheet preview

    TEA1521P/N2,112 Frequently Asked Questions (FAQs)

    • A good PCB layout for the TEA1521P/N2,112 involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the IC. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
    • To ensure the TEA1521P/N2,112 operates within its SOA, monitor the output current, voltage, and power dissipation. Use a thermal management system to keep the junction temperature below 150°C. Also, ensure the input voltage is within the recommended range, and the output is not overloaded.
    • Critical components to consider when designing a power supply using the TEA1521P/N2,112 include the input and output capacitors, the transformer, and the rectifier diodes. Choose components with suitable voltage and current ratings, and ensure they can handle the expected power and thermal stress.
    • To troubleshoot issues with the TEA1521P/N2,112, start by checking the PCB layout, component values, and soldering quality. Verify that the input voltage and output load are within the recommended ranges. Use an oscilloscope to measure the output voltage and current, and check for signs of oscillation or instability.
    • To ensure EMI and EMC compliance when using the TEA1521P/N2,112, use a shielded transformer, keep the PCB layout compact, and use a common-mode choke to reduce emissions. Also, ensure the power supply is designed to meet the relevant regulatory standards, such as EN 55022 and CISPR 22.
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