For optimal performance, it's recommended to follow the PCB layout guidelines provided in the application note AN11544. Ensure a solid ground plane, decouple the power supply, and use thermal vias to dissipate heat. A thermal pad on the bottom of the package should be connected to a heat sink or a thermal ground plane.
The TEF6688HN/V102K is a highly configurable device. For different frequency bands and regions, configure the device using the SPI interface to set the desired frequency band, modulation scheme, and other parameters. Refer to the device's programming guide and the relevant regional standards for specific configuration settings.
The internal voltage regulators should be set according to the recommended settings in the datasheet. Typically, the internal regulators are set to 1.2V for the digital core and 2.5V for the analog circuits. However, these settings may vary depending on the specific application and power requirements.
To ensure EMC and reduce EMI, follow the guidelines in the application note AN11544. Use a shielded enclosure, keep sensitive analog circuits away from digital circuits, and use filtering and shielding on the PCB. Additionally, ensure that the device is properly decoupled and that the power supply is well-regulated.
When designing a power supply for the TEF6688HN/V102K, ensure a stable and well-regulated voltage supply. Use a low-dropout regulator (LDO) or a switching regulator with a high power supply rejection ratio (PSRR). Add decoupling capacitors close to the device and ensure that the power supply can handle the device's peak current requirements.
TEF6688HN/V102K datasheet
by NXP Semiconductors
