Texas Instruments provides a recommended layout and PCB design guide in their application note SLVAE03, which includes guidelines for component placement, routing, and decoupling to minimize noise and ensure optimal performance.
The choice of input and output capacitors depends on the specific application and frequency range. TI recommends using low-ESR capacitors with a value of 10nF to 100nF for input decoupling and 100nF to 1uF for output decoupling. The capacitor selection guide in the datasheet can be used as a starting point.
The maximum power dissipation of the THS4021ID is dependent on the package type and ambient temperature. The power dissipation can be calculated using the formula Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current. The maximum power dissipation is specified in the datasheet as 1.4W for the SOIC package.
To ensure stability and prevent oscillations, it is recommended to follow the guidelines in the datasheet for component selection, PCB layout, and compensation. Additionally, the THS4021ID has a built-in compensation network, and the use of external compensation components is not recommended. If oscillations occur, check the PCB layout, decoupling, and component selection, and consider adding a small series resistor at the output to improve stability.
The THS4021ID has built-in ESD protection diodes on the input pins, which can withstand up to 2kV of ESD voltage. However, it is still recommended to follow proper ESD handling procedures when handling the device, and to use ESD protection devices such as TVS diodes or ESD arrays on the PCB to protect the device from ESD damage.
THS4021ID datasheet
by Texas Instruments
