A good PCB layout for the THS4051CD involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
The gain resistor values for the THS4051CD depend on the desired gain and bandwidth of the amplifier. A good starting point is to use the gain resistor calculator provided by Texas Instruments or to consult the application notes for guidance on selecting the optimal resistor values for your specific application.
The maximum power dissipation of the THS4051CD is 1.4W. To ensure you don't exceed it, calculate the power dissipation using the formula Pd = (Vcc x Icc) + (Vout x Iout), and make sure it's within the recommended limit. You can also use thermal design and layout techniques, such as using a heat sink or a thermal pad, to reduce the junction temperature.
To filter out high-frequency noise and EMI, use a combination of passive components, such as RC filters, and active components, such as operational amplifiers. Additionally, use shielding, grounding, and layout techniques to minimize the impact of EMI on your design.
To ensure EMC in a THS4051CD-based design, consider the following: use a shielded enclosure, minimize loop areas, use twisted pairs, and avoid running sensitive signals near noise sources. Additionally, follow good PCB layout practices, such as keeping analog and digital signals separate, and using a solid ground plane.
THS4051CD datasheet
by Texas Instruments
