Texas Instruments recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or fans, to keep the device within the recommended temperature range.
The maximum allowable voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 3.3V ± 10%.
The TIBPAL16R6-30MJ is not hermetically sealed, so it's not recommended for use in high-humidity environments. If you need to operate the device in a humid environment, consider using a conformal coating or potting the device to protect it from moisture.
The recommended soldering temperature is 260°C (peak temperature) with a soldering time of 10-30 seconds. It's essential to follow the recommended soldering profile to avoid damaging the device.
TIBPAL16R6-30MJ datasheet
by Texas Instruments
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