A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the input and output traces short and away from each other. Additionally, use a decoupling capacitor (e.g., 0.1uF) close to the VCC pin to filter out noise.
Ensure good thermal conduction by mounting the device on a heat sink or a metal core PCB, and provide adequate airflow around the device. Also, avoid operating the device near its maximum temperature rating for extended periods.
Power up the device in the following sequence: VCC, then VREF, and finally the input signals. This ensures that the internal voltage regulators are stable before the analog circuitry is enabled.
To avoid overheating, ensure that the output current does not exceed the specified maximum current (typically 20mA). Use external buffers or amplifiers if higher currents are required. Also, consider using a heat sink or a metal core PCB to dissipate heat.
Use a metal shield or a shielded enclosure to contain radiated emissions. Ensure good grounding and decoupling practices, and use EMI filters or chokes on the input and output lines if necessary. Additionally, consider using a spread-spectrum clock or a clock with a low EMI profile.
TLC5540IPW datasheet
by Texas Instruments
