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    Part Img TLVH432ACDBZR datasheet by Texas Instruments

    • PMIC - Voltage Reference, Integrated Circuits (ICs), IC VREF SHUNT PREC ADJ SOT23-3
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
    • Find it at Findchips.com
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    TLVH432ACDBZR datasheet preview

    TLVH432ACDBZR Frequently Asked Questions (FAQs)

    • Texas Instruments recommends a compact layout with short traces, and placing the device close to the power supply decoupling capacitors. Additionally, separating the analog and digital grounds and using a solid ground plane can help reduce noise.
    • The TLVH432ACDBZR has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Also, follow the recommended operating temperature range and derate the device accordingly.
    • The recommended input capacitance is 10nF to 100nF, and output capacitance is 100nF to 1μF. Increasing the input capacitance can improve noise rejection, while increasing the output capacitance can improve load regulation. However, excessive capacitance can lead to instability and oscillations.
    • To ensure stability, follow the recommended output capacitance and ESR (Equivalent Series Resistance) values. Additionally, add a 1kΩ to 10kΩ resistor in series with the output capacitor to dampen oscillations. You can also use the Texas Instruments' stability analysis tool to simulate and optimize the design.
    • Keep the power traces short and wide, and use a solid ground plane to reduce inductance. Route the input and output traces away from each other and from noisy signals. Avoid vias and layer changes under the device, and use a consistent layer stack-up to minimize signal reflections.
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