TMS320C6722BRFP200 datasheet by Texas Instruments

TMS320C6722BRFP200 Frequently Asked Questions (FAQs)

• What is the recommended power-up sequence for the TMS320C6722BRFP200?
  The recommended power-up sequence is to apply VDD (1.2V) first, followed by VIO (1.8V or 3.3V) and then the clock signal. This ensures proper device operation and prevents latch-up.
• How do I configure the external memory interface (EMIF) for optimal performance?
  To configure the EMIF for optimal performance, ensure that the memory clock frequency is set to 1/2 or 1/4 of the CPU clock frequency. Also, adjust the EMIF timing parameters (e.g., CAS latency, RAS-to-CAS delay) based on the specific memory module used.
• What is the maximum allowed clock skew between the CPU clock and the EMIF clock?
  The maximum allowed clock skew between the CPU clock and the EMIF clock is 1.5 ns. Exceeding this limit may cause data corruption or system instability.
• How do I implement a reliable reset mechanism for the TMS320C6722BRFP200?
  Implement a reset mechanism using a dedicated reset pin (e.g., RESETn) and ensure that the reset signal is asserted for at least 10 clock cycles to guarantee a clean reset. Also, consider using a power-on reset (POR) circuit to ensure a reliable reset during power-up.
• What are the thermal design considerations for the TMS320C6722BRFP200?
  To ensure reliable operation, maintain a junction temperature (TJ) below 125°C. Use thermal design guidelines (e.g., thermal vias, heat sinks) to minimize thermal resistance and ensure adequate heat dissipation.