The recommended power-up sequence is to apply power to the core voltage (VDD) first, followed by the I/O voltage (VDDIO), and then the clock signal. This ensures proper device operation and prevents latch-up or damage.
To optimize the DDR2 memory interface, ensure that the memory clock frequency is set correctly, and the memory timing parameters (tCL, tRAS, tRCD, tWR) are configured according to the memory module's specifications. Additionally, use the EMIF clock domain crossing feature to minimize clock domain crossing latency.
The maximum operating temperature range for the DM6467 is -40°C to 85°C (industrial temperature range). However, it's recommended to operate the device within a temperature range of 0°C to 70°C for optimal performance and reliability.
To configure the device for low-power operation, use the Power and Sleep Controller (PSC) module to control the power domains and clock frequencies. Additionally, use the Low-Power Mode (LPM) feature to reduce power consumption when the device is idle or in standby mode.
The maximum clock frequency supported by the DM6467 is 720 MHz. However, the actual clock frequency may be limited by the specific application, system design, and thermal considerations.
TMS320DM6467CCUT datasheet
by Texas Instruments
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