A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the power and ground planes as close as possible to the device to minimize inductance. Use a decoupling capacitor (e.g., 0.1 μF) between VCC and GND, and place it as close to the device as possible.
Use differential signaling (e.g., RS-485) and implement proper termination and shielding. Ensure that the signal lines are properly routed and separated from power lines. Consider using a common-mode choke or ferrite bead to filter out high-frequency noise.
The TMS3705DDRQ1 is rated for operation from -40°C to 125°C (junction temperature). However, the device's performance and reliability may degrade at extreme temperatures. Ensure proper thermal management and consider using a heat sink if the device will be operating at high temperatures.
Ensure that the power supply voltage (VCC) is stable and within the recommended range (1.65 V to 3.6 V) before applying the reset signal (RESET). Use a power-on reset (POR) circuit or a voltage supervisor to ensure a clean reset signal. Hold the reset signal low for at least 10 ms to ensure a proper reset.
Use ESD-sensitive handling procedures when handling the device. Ensure that the PCB is designed with ESD protection in mind, including the use of ESD-protection diodes and resistors. Consider using a device with built-in ESD protection, such as the TMS3705DDRQ1, which has a human-body model (HBM) ESD rating of ±2 kV.