A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
Choose an input capacitor with a high ripple current rating, low ESR, and a voltage rating that exceeds the maximum input voltage. Ensure the capacitor is placed close to the device's input pins.
Use a shielded enclosure, keep the device and input/output traces away from the PCB edge, and add EMI filters or common-mode chokes as needed. Ensure proper grounding and decoupling of the device.
Apply the input voltage, then the enable signal (EN). Ensure the input voltage is stable before asserting the enable signal. A soft-start circuit can be added to reduce inrush current.
