Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to minimize thermal resistance. A minimum of 2 oz copper thickness is recommended for optimal thermal performance.
To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking, using a thermally conductive PCB material, and minimizing power dissipation. Additionally, consider using a thermal interface material (TIM) between the device and the heat sink.
Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and prevent damage to the device.
Texas Instruments recommends using a human-body model (HBM) ESD protection circuit with a minimum of 2 kV rating to protect the device from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
A 10 μF to 22 μF ceramic capacitor with an X5R or X7R dielectric is recommended for input decoupling. The capacitor should be placed as close as possible to the input pins to minimize noise and ensure stable operation.
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