A good PCB layout for the TPA2010D1YZFT involves keeping the input and output traces short and away from each other, using a ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
The gain setting depends on the input signal level, desired output power, and system impedance. TI provides a gain setting table in the datasheet, and you can also use the TI Audio Amplifier Gain Calculator tool to help select the optimal gain setting.
The maximum power dissipation of the TPA2010D1YZFT is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a power dissipation calculation formula in the datasheet, and you can also use the TI Power Dissipation Calculator tool to estimate the maximum power dissipation.
To protect the TPA2010D1YZFT from overvoltage and ESD, use a voltage regulator to regulate the supply voltage, add TVS diodes for overvoltage protection, and follow proper ESD handling and storage procedures. TI also recommends using a voltage clamp circuit to protect the device from voltage spikes.
For thermal management, use a heat sink or thermal pad to dissipate heat, ensure good airflow around the device, and avoid blocking airflow with components or obstacles. TI provides thermal resistance values in the datasheet to help with thermal design.
TPA2010D1YZFT datasheet
by Texas Instruments
