According to TI's application notes, a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed close to the power pins, are recommended for power supply decoupling.
The gain setting depends on the input signal level and the desired output power. TI recommends using the gain setting formula provided in the datasheet, and adjusting it based on the specific application requirements.
The maximum power dissipation of the TPA2039D1YFFR is 2.5W. However, this value can be affected by the ambient temperature, PCB layout, and other factors. It's essential to follow proper thermal design and layout guidelines to ensure reliable operation.
Yes, the TPA2039D1YFFR can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the output stage design, PCB layout, and thermal management to ensure reliable operation.
TI recommends using a combination of passive filtering components, such as capacitors and inductors, and proper PCB layout techniques to minimize noise and EMI. Additionally, using a common-mode filter or a ferrite bead can help reduce high-frequency noise.