According to TI's application notes, a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor is recommended for power supply decoupling, placed as close to the device as possible.
To minimize electromagnetic interference (EMI) and ensure optimal performance, keep the signal traces short and away from the power supply lines, use a solid ground plane, and place the device close to the power supply decoupling capacitors.
The maximum power dissipation of the TPA301DGNR is 2.5W, assuming a junction temperature of 150°C. However, this value can be derated based on the ambient temperature and other factors.
Yes, the TPA301DGNR can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the power supply, PCB layout, and thermal management to avoid overheating and ensure reliable operation.
Use a voltage supervisor or a power-on reset circuit to monitor the power supply voltage and reset the device if it falls outside the recommended operating range (4.5V to 18V). Additionally, consider using a transient voltage suppressor (TVS) diode to protect against voltage spikes.
TPA301DGNR datasheet
by Texas Instruments
