A good PCB layout for the TPA6110A2DGNR involves keeping the audio signal traces short and away from the power supply traces, using a solid ground plane, and placing the decoupling capacitors close to the device. TI provides a recommended PCB layout in the datasheet and application notes.
The gain setting depends on the input signal level and the desired output power. A higher gain setting can provide more output power, but may also increase noise and distortion. A lower gain setting can provide a cleaner signal, but may not provide enough output power. TI provides a gain calculation formula in the datasheet.
The maximum power dissipation of the TPA6110A2DGNR is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a thermal derating curve in the datasheet to help estimate the maximum power dissipation.
The TPA6110A2DGNR has built-in overvoltage protection, but it's still recommended to add external protection circuitry, such as a voltage regulator and a crowbar circuit, to protect the device from overvoltage and undervoltage conditions.
The recommended input coupling capacitor value depends on the input signal frequency and amplitude. A general rule of thumb is to use a capacitor with a value of at least 10uF to ensure a flat frequency response.
TPA6110A2DGNR datasheet
by Texas Instruments
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