According to TI's application notes, a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed close to the power pins, are recommended for power supply decoupling.
The gain setting depends on the input signal level and the desired output power. TI recommends using the gain calculation formula provided in the datasheet, and adjusting the gain resistors accordingly.
The maximum power dissipation of the TPA6130A2RTJR is dependent on the ambient temperature and the thermal resistance of the PCB. TI recommends using the thermal calculation formula provided in the datasheet to determine the maximum power dissipation for a specific application.
TI recommends using thermal monitoring and shutdown circuitry, such as the TPS3828, to protect the TPA6130A2RTJR from overheating. Additionally, ensuring good thermal design and heat sinking can help prevent overheating.
TI recommends following the PCB layout guidelines provided in the datasheet, including using a solid ground plane, separating analog and digital grounds, and minimizing trace lengths and widths.
TPA6130A2RTJR datasheet
by Texas Instruments
