The recommended PCB layout for the TPA751D involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. TI provides a reference design and layout guidelines in the TPA751D datasheet and application notes.
The gain setting for the TPA751D depends on the specific application requirements. The device has three gain settings: 6 dB, 12 dB, and 18 dB. The gain setting should be chosen based on the input signal level, output power requirements, and noise tolerance. A higher gain setting can provide more output power, but may also increase noise and distortion. TI provides a gain selection guide in the TPA751D datasheet.
The maximum power dissipation of the TPA751D depends on the ambient temperature and the thermal resistance of the PCB. The device has a maximum junction temperature of 150°C. The power dissipation can be calculated using the formula: Pd = (Vcc x Icc) + (Vout x Iout). TI provides a thermal design guide and power dissipation calculations in the TPA751D datasheet.
To filter out EMI in a design using the TPA751D, it is recommended to use a common-mode filter, such as a ferrite bead or a common-mode choke, on the input and output lines. Additionally, a shielded enclosure and a solid ground plane can help to reduce EMI. TI provides EMI reduction guidelines and filter design recommendations in the TPA751D datasheet and application notes.
The minimum supply voltage for the TPA751D is 4.5 V, and the maximum supply voltage is 18 V. The device is designed to operate from a single supply voltage, and the output voltage swing is dependent on the supply voltage. TI recommends using a regulated power supply to ensure stable operation and to prevent damage to the device.
TPA751D datasheet
by Texas Instruments
