A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-current paths short and wide, and use vias to connect the power planes to the device pins.
Follow the recommended power-up sequence: VCC, then EN, then VIN. Ensure the input voltage is within the recommended range, and the EN pin is pulled high to enable the device.
The maximum current rating is 1.5 A. Calculate power dissipation using the formula: Pd = (VIN - VOUT) x IOUT. Ensure the device is properly heatsinked to prevent overheating.
Use the FB pin to set the output voltage. The device supports output voltages from 0.9 V to 3.3 V. However, the output voltage range is limited by the input voltage and the internal voltage drop.
The device has a thermal shutdown at 150°C. Ensure good airflow, use a heatsink, and keep the device away from other heat sources. Monitor the junction temperature and adjust the design accordingly.