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    Part Img TPS2393APW datasheet by Texas Instruments

    • -48V Hot Swap with Insertion and Removal Detection Delay
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
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    TPS2393APW datasheet preview

    TPS2393APW Frequently Asked Questions (FAQs)

    • A good PCB layout for the TPS2393APW involves placing the device close to the power source, using a solid ground plane, and keeping the input and output traces short and wide to minimize inductance and resistance. Additionally, it's recommended to use a common ground point for the input and output capacitors to reduce noise and improve stability.
    • The choice of input and output capacitors for the TPS2393APW depends on the specific application requirements. In general, X5R or X7R ceramic capacitors with a voltage rating of at least 2x the input voltage are recommended. The capacitance value should be at least 10uF for the input capacitor and 22uF for the output capacitor. It's also important to consider the ESR (Equivalent Series Resistance) and ESL (Equivalent Series Inductance) of the capacitors to ensure they can handle the high-frequency switching of the converter.
    • The TPS2393APW is rated for operation from -40°C to 85°C ambient temperature. However, the device's performance and reliability may be affected at extreme temperatures. It's recommended to derate the device's power handling and efficiency at high temperatures to ensure reliable operation.
    • Proper thermal management of the TPS2393APW involves providing a good thermal path from the device to a heat sink or the PCB. This can be achieved by using a thermal interface material (TIM) such as thermal tape or thermal grease, and ensuring good contact between the device and the heat sink or PCB. The PCB should also be designed to dissipate heat efficiently, with thermal vias and a solid ground plane.
    • When using the TPS2393APW, it's essential to consider EMI filtering and shielding to ensure compliance with regulatory requirements and to prevent electromagnetic interference. This can be achieved by using EMI filters, such as common-mode chokes and capacitors, and shielding the device and PCB with a metal enclosure or shielded cables.
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