TPS2561AQDRCRQ1 datasheet by Texas Instruments

TPS2561AQDRCRQ1 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the TPS2561AQDRCRQ1 to ensure optimal performance?
  A good PCB layout for the TPS2561AQDRCRQ1 involves placing the device close to the load, using short and wide traces for power and ground, and separating the power and ground planes to minimize noise and EMI.
• How do I choose the right external components for the TPS2561AQDRCRQ1, such as the inductor and capacitors?
  Choose external components based on the specific application requirements, such as output voltage, current, and frequency. Use the datasheet's recommended component values as a starting point and adjust as needed for optimal performance.
• What are the thermal considerations for the TPS2561AQDRCRQ1, and how can I ensure reliable operation over temperature?
  The TPS2561AQDRCRQ1 has a junction-to-ambient thermal resistance of 24°C/W. Ensure reliable operation by providing adequate heat sinking, using a thermal pad or heat sink, and following the recommended PCB layout guidelines.
• How do I implement overcurrent protection with the TPS2561AQDRCRQ1, and what are the limitations of the built-in OCP?
  The TPS2561AQDRCRQ1 has a built-in overcurrent protection (OCP) feature that limits the output current to 2.5A. To implement OCP, connect the OCP pin to a resistor divider network that sets the OCP threshold. Note that the built-in OCP has a 10% tolerance, so external OCP circuits may be needed for more precise control.
• What are the EMI and EMC considerations for the TPS2561AQDRCRQ1, and how can I minimize electromagnetic interference?
  To minimize EMI, use a shielded inductor, place the device close to the load, and use a common-mode choke or ferrite bead on the input and output lines. Follow the recommended PCB layout guidelines and use a ground plane to reduce radiation.