A good PCB layout is crucial for the TPS3125L30DBVRG4. TI recommends a 4-layer PCB with a solid ground plane, and the input and output capacitors should be placed close to the device. The input capacitor should be connected between VIN and GND, and the output capacitor should be connected between VOUT and GND. Additionally, the device's thermal pad should be connected to a solid ground plane or a heat sink.
The input capacitor should have a low ESR (Equivalent Series Resistance) and be rated for the input voltage. A 10uF to 22uF ceramic capacitor is a good choice. The output capacitor should also have a low ESR and be rated for the output voltage. A 10uF to 47uF ceramic capacitor is suitable. TI recommends using X5R or X7R dielectric capacitors.
The TPS3125L30DBVRG4 is rated for operation up to 85°C ambient temperature. However, for reliable operation, TI recommends keeping the ambient temperature below 70°C to ensure the device's internal temperature remains within its operating range.
To ensure stability, TI recommends following the PCB layout guidelines, using the recommended input and output capacitors, and keeping the device's input and output voltage rails clean and free from noise. Additionally, the device's feedback network should be properly designed and connected.
The TPS3125L30DBVRG4 has a minimum startup voltage of 2.5V. However, the device can operate down to 2.2V with a reduced output voltage range.