TPS40009DGQR datasheet by Texas Instruments

TPS40009DGQR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
• How do I ensure the device operates within the recommended operating conditions?
  Monitor the input voltage, output voltage, and output current to ensure they are within the specified ranges. Also, ensure the device is operated within the recommended junction temperature range.
• What is the recommended input capacitor type and value for this device?
  A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10-22 μF is recommended for input decoupling. Place the capacitor close to the VIN pin.
• How do I calculate the output voltage ripple for this device?
  The output voltage ripple can be estimated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.
• What is the recommended output capacitor type and value for this device?
  A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 22-47 μF is recommended for output filtering. Choose a capacitor with a voltage rating that exceeds the output voltage.