TI recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to minimize thermal impedance. A minimum of 2 oz copper thickness is recommended for the top layer.
Monitor the input voltage, output voltage, and output current to ensure they are within the recommended operating ranges. Also, ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
TI recommends using a low-ESR ceramic capacitor with a value of 10 μF to 22 μF, and a voltage rating of at least 2x the input voltage. X5R or X7R dielectric types are recommended for their low temperature coefficient and high reliability.
The output voltage ripple can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency. TI provides a calculation tool and guidelines in the datasheet and application notes.
TI recommends using a low-ESR ceramic capacitor with a value of 10 μF to 47 μF, and a voltage rating of at least 1.5x the output voltage. X5R or X7R dielectric types are recommended for their low temperature coefficient and high reliability.
TPS40077PWPRG4 datasheet
by Texas Instruments
