A good PCB layout for the TPS826711SIPR involves placing the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. TI provides a recommended PCB layout in the datasheet and application notes.
The choice of input and output capacitors depends on the specific application requirements. TI recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and output. The X5R or X7R dielectric is recommended for its stability over temperature.
The TPS826711SIPR is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures. It's essential to consider the thermal design and heat dissipation in the system.
Yes, the TPS826711SIPR is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive applications and is manufactured using a high-reliability process. However, it's essential to consult with TI's application engineers to ensure the device meets the specific requirements of the application.
To troubleshoot issues with the TPS826711SIPR, start by checking the PCB layout, input and output capacitor selection, and thermal design. Verify that the device is operated within its recommended specifications. Use oscilloscopes and thermal imaging cameras to identify the root cause of the issue. Consult TI's application notes and technical support resources for guidance.
TPS826711SIPR datasheet
by Texas Instruments
