For optimal performance, it's recommended to follow Texas Instruments' recommended PCB layout guidelines, including using a solid ground plane, minimizing trace lengths, and using thermal vias to dissipate heat. A thermal pad on the bottom of the package should be connected to a solid copper plane on the PCB to ensure efficient heat dissipation.
To ensure signal integrity and minimize EMI emissions, use a multi-layer PCB with a solid ground plane, keep signal traces short and away from the edge of the board, and use shielding or filtering components as needed. Additionally, follow Texas Instruments' recommended layout guidelines and use a common-mode choke or ferrite bead to filter out high-frequency noise.
For optimal performance, use a low-ESR capacitor (e.g., 100nF) as close as possible to the TRF372017IRGZT's power pins. Add a 10uF or larger capacitor in parallel to filter out low-frequency noise. Use a ferrite bead or common-mode choke to filter out high-frequency noise on the power supply lines.
To optimize the TRF372017IRGZT's performance, consult the device's datasheet and application notes for specific guidance on settings and configurations. Additionally, consider using Texas Instruments' development tools and software, such as the TRF37xx Evaluation Module, to fine-tune the device's performance for your specific application.
The TRF372017IRGZT is a high-reliability device with a proven track record in various applications. Texas Instruments provides detailed reliability and quality metrics, including MTBF (Mean Time Between Failures) and FIT (Failures in Time) rates, in the device's datasheet and quality/reliability reports.
TRF372017IRGZT datasheet
by Texas Instruments
