Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good RF design practices, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines to ensure optimal performance.
The input/output matching network depends on the specific application and frequency range. TI provides a matching network design guide, and engineers can use tools like TI's RF Impedance Matching Tool or third-party software like ADS or AWR to design and simulate the matching network.
The TRF37B73IDSGR can handle up to 30 dBm (1W) of input power, but the actual power handling capability depends on the specific application, frequency, and operating conditions. Engineers should consult the datasheet and application notes for more information.
The TRF37B73IDSGR operates from -40°C to 85°C. Engineers should ensure proper thermal design, including heat sinking and airflow, to maintain the device within the specified temperature range. They should also consider the thermal resistance of the package and PCB.
The TRF37B73IDSGR has built-in ESD protection, but engineers should still follow proper ESD handling procedures, such as using an ESD wrist strap, mat, or workstation, and storing the devices in anti-static packaging.
TRF37B73IDSGR datasheet
by Texas Instruments
