Texas Instruments provides a recommended PCB layout in the application note SLAA566, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
The TRF7900APW can be configured for different frequency bands by adjusting the values of the external components, such as the inductors and capacitors, according to the application note SLAA567. Additionally, the device can be programmed using the SPI interface to select the desired frequency band.
The TRF7900APW is designed to handle a maximum input power of +20 dBm, but the actual power handling capability may vary depending on the specific application and operating conditions. It is recommended to consult the application note SLAA568 for more information on power handling and thermal management.
Impedance matching can be implemented using external components, such as resistors, inductors, and capacitors, to match the input and output impedances of the device to the system requirements. Texas Instruments provides a impedance matching calculator tool to help with the design process.
The TRF7900APW is a high-power device that requires proper thermal management to ensure reliable operation. The device has a thermal pad that must be connected to a heat sink or a thermal ground plane to dissipate heat. The application note SLAA569 provides guidelines for thermal management and heat sink design.
TRF7900APW datasheet
by Texas Instruments
