STMicroelectronics recommends a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, ensure proper thermal management, such as using a heat sink or thermal interface material, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
STMicroelectronics recommends using a low-ESR ceramic capacitor with a value between 1uF to 10uF, depending on the specific application requirements. A higher capacitance value can help reduce output voltage ripple, but may increase the startup time.
To troubleshoot output voltage instability or oscillations, check the input voltage, output load, and PCB layout for any issues. Ensure the input capacitor is properly sized and placed close to the device, and the output capacitor is suitable for the application. Also, verify that the device is not operating in a region of instability, such as near the minimum or maximum output current.
STMicroelectronics recommends using a low-ESR ceramic or polymer capacitor with a value between 10uF to 100uF, depending on the specific application requirements. A higher capacitance value can help reduce output voltage ripple, but may increase the startup time.
TS274ACDT datasheet
by STMicroelectronics
