TS3702IN datasheet by STMicroelectronics

TS3702IN Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the TS3702IN?
  STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
• How do I handle the thermal dissipation of the TS3702IN?
  The TS3702IN has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
• What is the maximum operating temperature range for the TS3702IN?
  The TS3702IN is rated for operation from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. The device should be derated for operation above 85°C to ensure reliability.
• How do I protect the TS3702IN from electrostatic discharge (ESD)?
  The TS3702IN is sensitive to ESD, so proper handling and storage procedures should be followed. Use an ESD wrist strap or mat, and ensure that the device is stored in an anti-static bag or tube.
• What is the recommended input capacitor value for the TS3702IN?
  The recommended input capacitor value is 10uF to 22uF, with a voltage rating of at least 50V. The capacitor should be placed as close as possible to the VIN pin to ensure proper filtering and decoupling.