Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device.
To ensure signal integrity, use controlled impedance traces, minimize trace lengths, and avoid vias and stubs. Also, use a common mode filter or a differential filter to reduce electromagnetic interference (EMI) and improve signal quality.
The maximum cable length supported by the TS3USB3031RMGR depends on the specific application and the type of cable used. As a general guideline, the device supports cable lengths up to 3 meters for USB 2.0 and 1 meter for USB 3.0.
Power sequencing is critical to ensure proper device operation. The recommended power-up sequence is to apply VCC first, followed by VCCIO, and then the input signals. The power-down sequence should be reversed.
The TS3USB3031RMGR has a maximum junction temperature of 150°C. To ensure reliable operation, keep the device within the recommended operating temperature range, and use thermal pads or heat sinks if necessary to dissipate heat.
TS3USB3031RMGR datasheet
by Texas Instruments
