STMicroelectronics provides a recommended PCB layout in the application note AN5096, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
The TS952IN has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink or thermal ground plane.
The TS952IN is rated for operation from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. The device should be derated for operation above 85°C to ensure reliability and prevent thermal runaway.
The TS952IN is sensitive to ESD, so it's essential to handle the device with ESD-safe materials and follow proper handling and storage procedures. A human body model (HBM) ESD protection diode can be added to the input pins to protect against ESD events.
The TS952IN can operate from a single 2.7V to 5.5V supply, but the recommended input voltage range is 3.3V ±10% to ensure optimal performance and reliability.
TS952IN datasheet
by STMicroelectronics
