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    Part Img TS952IPT datasheet by STMicroelectronics

    • INPUT-OUTPUT RAIL TO RAIL LOW POWER OP-AMPS
    • Original
    • Yes
    • Active
    • EAR99
    • 8542.33.00.01
    • 8542.33.00.00
    • Find it at Findchips.com

    TS952IPT datasheet preview

    TS952IPT Frequently Asked Questions (FAQs)

    • A good PCB layout for the TS952IPT involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals.
    • The TS952IPT requires a single 3.3V power supply, and it's recommended to use a low-dropout regulator (LDO) to ensure a clean power supply. The power sequencing requirement is to power up the device after the power supply has stabilized, and to ensure that the analog power supply is powered up before the digital power supply.
    • The recommended clocking scheme for the TS952IPT is to use a single-ended clock input, and to ensure that the clock signal is clean and has minimal jitter. To minimize clock jitter, it's recommended to use a clock source with a low jitter specification, and to use a clock buffer or repeater to regenerate the clock signal if necessary.
    • The TS952IPT has several configuration options that can be set through the SPI interface. To configure the device for optimal performance, it's recommended to consult the datasheet and application notes, and to use the STMicroelectronics evaluation board as a reference design. Additionally, it's recommended to perform thorough testing and characterization of the device in the specific application to ensure optimal performance.
    • The TS952IPT has a maximum junction temperature of 150°C, and it's recommended to ensure that the device operates within a temperature range of -40°C to 85°C. To ensure proper thermal management, it's recommended to use a heat sink or thermal pad, and to ensure good airflow around the device. Additionally, it's recommended to monitor the device temperature and adjust the thermal design as necessary.
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