A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Use a soldering profile with a peak temperature of 260°C (500°F) for 10-15 seconds. Ensure the component is properly aligned and the PCB is clean and dry.
The maximum allowed voltage transient is 1.5 times the maximum rated voltage (VDRM) for a duration of 10 ms. Exceeding this may damage the device.
Yes, but ensure the switching frequency is below 100 kHz to minimize losses. Also, consider the device's reverse recovery time (trr) and ensure it meets your application's requirements.
Handle the device in an ESD-controlled environment. Use an ESD wrist strap or mat, and ensure all equipment is grounded. Avoid touching the device's pins or leads.
