STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management.
The TSZ122IST requires a specific biasing scheme to achieve optimal performance. Refer to the application note AN5323 for detailed information on biasing and configuration.
The maximum power dissipation of the TSZ122IST is dependent on the package type and thermal management. Refer to the datasheet for specific power dissipation values and thermal management guidelines.
The TSZ122IST is rated for operation up to 125°C. However, it's essential to follow the recommended thermal management guidelines to ensure reliable operation in high-temperature environments.
STMicroelectronics provides a troubleshooting guide in the application note AN5323, which covers common issues and debugging techniques for the TSZ122IST.