Texas Instruments provides a recommended PCB layout guide in the application note SLUA433, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The TWL1103TPBSRQ1 is a highly configurable device, and the configuration depends on the specific application requirements. Texas Instruments provides a software tool called the TWL1103 Configurator, which allows designers to configure the device for their specific use case. The tool provides a graphical user interface to set up the device's registers and configure the power management, audio, and other functions.
The TWL1103TPBSRQ1 has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat effectively. Texas Instruments recommends using a thermal via array under the device to improve heat dissipation. Additionally, the device has a thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C to prevent damage.
Texas Instruments provides a troubleshooting guide in the application note SLUA434, which includes a step-by-step approach to identifying and resolving common issues with the TWL1103TPBSRQ1. The guide covers topics such as power sequencing, clocking, and audio functionality.
Texas Instruments recommends using a combination of ceramic and electrolytic capacitors to decouple the power supplies of the TWL1103TPBSRQ1. A 10uF ceramic capacitor and a 22uF electrolytic capacitor are recommended for the VDD_CORE and VDD_ANA power domains, respectively. The capacitors should be placed as close as possible to the device's power pins.
TWL1103TPBSRQ1 datasheet
by Texas Instruments
