TE Connectivity provides a recommended PCB layout and land pattern in their application note AN-1043, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal management and signal integrity.
The TXR54AC90-1005AI has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the component and consider using a heat sink if necessary.
The TXR54AC90-1005AI has an operating temperature range of -40°C to 125°C. However, the maximum junction temperature (Tj) should not exceed 150°C. It's essential to ensure the component stays within these temperature limits to maintain reliability and performance.
The TXR54AC90-1005AI is designed to withstand moderate vibration levels. However, if your application involves extreme vibration, you should consider additional mechanical support or vibration dampening measures to ensure the component's reliability.
The TXR54AC90-1005AI has a moisture sensitivity level (MSL) of 3, which means it can withstand some humidity. However, to ensure reliability, it's recommended to follow proper handling and storage procedures, and consider using a conformal coating or potting compound to protect the component from moisture.
TXR54AC90-1005AI datasheet
by TE Connectivity
