A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper airflow and avoid thermal hotspots.
Choose an input capacitor with a high ripple current rating, low ESR, and a voltage rating that exceeds the maximum input voltage. X7R or X5R dielectrics are recommended.
Use a shielded enclosure, keep the layout compact, and minimize loop areas. Add EMI filters or common-mode chokes as needed. Ensure proper grounding and decoupling.
Use a low-ESR output capacitor with a value between 10uF to 22uF. A ceramic or polymer capacitor with a voltage rating that exceeds the output voltage is recommended.