A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
Monitor the device's junction temperature, ensure the input voltage is within the recommended range, and avoid exceeding the maximum current ratings. Also, use a suitable heat sink to prevent overheating.
Use a common mode choke, add a ferrite bead or a pi-filter to the input, and ensure the PCB layout is optimized for EMI reduction. Also, consider adding a shield or a metal can to the device.
Check the PCB layout, ensure proper decoupling, and verify the input voltage and current ratings. Use an oscilloscope to analyze the output waveform and check for signs of oscillation or instability.
Use a heat sink with a thermal resistance of <1°C/W, ensure good airflow, and avoid blocking the airflow around the device. Also, consider using a thermal interface material to improve heat transfer.