UCC27516DRSR datasheet by Texas Instruments

UCC27516DRSR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the UCC27516DRSR to minimize EMI?
  A good PCB layout for the UCC27516DRSR involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing loop areas. TI provides a recommended layout in the application note SLUA623.
• How do I choose the right inductor value for my application?
  The inductor value depends on the input voltage, output voltage, and desired switching frequency. A good starting point is to use the inductor selection guide in the UCC27516DRSR datasheet, and then fine-tune the value based on the specific application requirements.
• What is the maximum ambient temperature for the UCC27516DRSR?
  The maximum ambient temperature for the UCC27516DRSR is 85°C, but the device can operate up to 125°C junction temperature. Be sure to follow the thermal design guidelines in the datasheet to ensure reliable operation.
• Can I use the UCC27516DRSR in a synchronous rectification topology?
  Yes, the UCC27516DRSR can be used in a synchronous rectification topology. In this configuration, the internal high-side FET is used as the main switch, and an external low-side FET is used as the synchronous rectifier. This can improve efficiency and reduce power losses.
• How do I troubleshoot issues with the UCC27516DRSR, such as oscillations or instability?
  To troubleshoot issues with the UCC27516DRSR, start by checking the PCB layout, component values, and voltage rails. Use an oscilloscope to observe the switching waveforms and identify any anomalies. Consult the datasheet and application notes for guidance on troubleshooting common issues.