UCC27524DR datasheet by Texas Instruments

UCC27524DR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the UCC27524DR to minimize EMI?
  A good PCB layout for the UCC27524DR involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing trace lengths and loops. TI provides a recommended layout in the application note SLUA623.
• How do I choose the right input capacitor for the UCC27524DR?
  The input capacitor should be selected based on the input voltage ripple requirement, output current, and switching frequency. A general guideline is to choose a capacitor with a capacitance value of at least 10uF, a voltage rating of 1.5 to 2 times the input voltage, and a low ESR (Equivalent Series Resistance).
• What is the maximum output current capability of the UCC27524DR?
  The UCC27524DR is capable of delivering up to 2A of output current, but this depends on the input voltage, output voltage, and thermal conditions. It's essential to check the thermal derating curves in the datasheet to ensure the device can handle the required output current.
• How do I synchronize the UCC27524DR with an external clock?
  The UCC27524DR can be synchronized with an external clock signal applied to the SYNC pin. The external clock frequency should be within the range of 100 kHz to 1 MHz, and the signal should be a square wave with a 50% duty cycle.
• What is the purpose of the EN pin on the UCC27524DR?
  The EN (Enable) pin is used to enable or disable the device. When the EN pin is pulled high, the device is enabled, and when it's pulled low, the device is disabled. This pin can be used to implement power sequencing or to shut down the device during fault conditions.