UCC27714DR datasheet by Texas Instruments

UCC27714DR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the UCC27714DR to minimize EMI?
  A good PCB layout for the UCC27714DR involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing loop areas. TI provides a recommended layout in the application note SLUA623.
• How do I choose the right input capacitor for the UCC27714DR?
  Choose an input capacitor with a voltage rating that exceeds the maximum input voltage, a capacitance value that meets the recommended range (e.g., 10-22 μF), and a low ESR to minimize voltage ripple. X5R or X7R ceramic capacitors are good options.
• What is the maximum ambient temperature for the UCC27714DR?
  The maximum ambient temperature for the UCC27714DR is 85°C, but the device can operate up to 125°C junction temperature. Ensure proper thermal design and heat sinking to maintain a safe junction temperature.
• Can I use the UCC27714DR in a synchronous rectification topology?
  Yes, the UCC27714DR can be used in a synchronous rectification topology. However, ensure that the external FETs are properly selected and driven to minimize losses and ensure efficient operation.
• How do I troubleshoot the UCC27714DR if it's not switching properly?
  Check the input voltage, enable pin, and clock signal. Verify that the device is properly configured and that the external components (e.g., inductor, capacitors) are correct. Use an oscilloscope to inspect the switching waveforms and identify any issues.