UCC28051DR datasheet by Texas Instruments

UCC28051DR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the UCC28051DR to minimize EMI?
  A good PCB layout for the UCC28051DR involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing loop areas. TI provides a recommended layout in the datasheet and application notes.
• How do I choose the right external components (e.g., inductors, capacitors) for my design?
  Choose external components based on the specific requirements of your design, such as output voltage, current, and switching frequency. TI provides guidelines and equations in the datasheet and application notes to help with component selection.
• What are the thermal considerations for the UCC28051DR, and how do I ensure reliable operation?
  The UCC28051DR has a maximum junction temperature of 150°C. Ensure reliable operation by providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device within the recommended operating temperature range.
• How do I implement overcurrent protection with the UCC28051DR?
  The UCC28051DR has a built-in overcurrent protection feature. Implement it by connecting a sense resistor (Rs) between the output inductor and the output capacitor, and adjusting the OCSET pin to set the overcurrent threshold.
• What are the key differences between the UCC28051DR and other similar controllers from TI, such as the UCC28050DR?
  The UCC28051DR is a dual-output controller, while the UCC28050DR is a single-output controller. The UCC28051DR also has a higher switching frequency range (up to 1.5 MHz) and a more comprehensive set of protection features.