UCC28061DR datasheet by Texas Instruments

UCC28061DR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the UCC28061DR to minimize EMI?
  A good PCB layout for the UCC28061DR involves keeping the high-frequency switching nodes (e.g., SW node) away from sensitive analog nodes, using a solid ground plane, and minimizing loop areas. TI provides a recommended layout in the datasheet and application notes.
• How do I choose the right external components (e.g., inductors, capacitors) for my design?
  Choose components based on the specific requirements of your design, such as output voltage, current, and frequency. TI provides guidelines and examples in the datasheet and application notes. You can also use online tools, such as TI's Power Stage Designer, to help with component selection.
• What are the thermal considerations for the UCC28061DR, and how do I ensure reliable operation?
  The UCC28061DR has a maximum junction temperature of 150°C. Ensure reliable operation by providing adequate heat sinking, using a thermal pad, and following TI's thermal design guidelines. You can also use thermal simulation tools to estimate junction temperature.
• How do I implement overcurrent protection (OCP) and short-circuit protection (SCP) with the UCC28061DR?
  The UCC28061DR has a built-in OCP and SCP feature. Implement OCP by setting the OCSET pin to the desired current limit, and SCP by using the SCP pin to detect short-circuit conditions. Refer to the datasheet and application notes for detailed implementation guidelines.
• What are the key considerations for EMI filtering and compliance with regulatory standards?
  To ensure EMI compliance, use a combination of filtering components (e.g., common-mode chokes, capacitors) and shielding techniques. Follow TI's EMI design guidelines and consult regulatory standards (e.g., CISPR, FCC) for specific requirements.