UCC2813D-2 datasheet by Texas Instruments

UCC2813D-2 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the UCC2813D-2 to minimize EMI?
  A good PCB layout for the UCC2813D-2 involves keeping the input and output stages separate, using a star-ground configuration, and placing the input filter components close to the IC. Additionally, using a solid ground plane and minimizing trace lengths can help reduce EMI.
• How do I choose the right input filter components for my application?
  The choice of input filter components depends on the specific application requirements. A good starting point is to use the recommended values in the datasheet, and then adjust based on the specific noise and ripple requirements of the system. It's also important to consider the component tolerances and temperature coefficients.
• What is the maximum output current that the UCC2813D-2 can deliver?
  The maximum output current of the UCC2813D-2 is dependent on the input voltage, output voltage, and thermal conditions. In general, the device can deliver up to 1.5A of output current, but this should be derated based on the specific application requirements and thermal conditions.
• How do I compensate for the output voltage droop during startup?
  The output voltage droop during startup can be compensated for by adding a soft-start circuit or a voltage supervisor circuit to the design. This helps to ensure that the output voltage reaches the desired level before the system is enabled.
• What is the recommended thermal management strategy for the UCC2813D-2?
  The UCC2813D-2 has a thermal pad that should be connected to a solid ground plane or a thermal heatsink to dissipate heat. Additionally, using a thermal interface material and ensuring good airflow around the device can help to reduce the junction temperature and improve reliability.