A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal pad away from high-current carrying traces and vias can help reduce thermal resistance.
To ensure reliable start-up of the UCC28C43MDREP, make sure the input voltage rises monotonically and does not droop during start-up. A soft-start circuit can be used to limit the inrush current and ensure a reliable start-up. Additionally, a sufficient input capacitance and a low-ESR output capacitor can help reduce voltage transients during start-up.
When selecting the output inductor for the UCC28C43MDREP, consider the inductor's saturation current, DC resistance, and core material. A low-DCR inductor with a high saturation current is recommended. The inductor's physical size, core material, and winding configuration also affect its performance. A shielded inductor can help reduce EMI.
To optimize the compensation network for the UCC28C43MDREP, use the device's recommended compensation components and follow the datasheet's guidelines. The compensation network should be designed to provide a stable closed-loop response with adequate phase margin and gain margin. A type-III compensation network is recommended for this device.
To minimize EMI, use a combination of filtering and shielding techniques. Use a common-mode choke and a differential-mode filter to reduce conducted EMI. A shielded inductor and a shielded layout can help reduce radiated EMI. Additionally, use a metal can or a shielded enclosure to contain EMI emissions.
UCC28C43MDREP datasheet
by Texas Instruments
