A good PCB layout for the UCC29002DGK involves keeping the input and output stages separate, using a star-ground configuration, and placing the input filter components close to the IC. Additionally, using a solid ground plane and minimizing trace lengths can help reduce EMI.
The choice of input filter components depends on the specific application and the desired level of EMI filtering. A good starting point is to use a combination of ceramic capacitors and ferrite beads, with values selected based on the frequency range of interest and the impedance of the input signal.
The UCC29002DGK is capable of delivering up to 2A of output current, but this may be limited by the thermal design of the PCB and the ambient temperature. It's essential to ensure that the device is properly heat-sinked and that the PCB is designed to handle the maximum output current.
Proper heat-sinking of the UCC29002DGK involves using a thermal interface material (TIM) between the device and the heat sink, ensuring good thermal contact between the device and the heat sink, and using a heat sink with a sufficient thermal conductivity. The heat sink should be designed to handle the maximum power dissipation of the device.
When selecting the output capacitor for the UCC29002DGK, consider the capacitance value, equivalent series resistance (ESR), and voltage rating. A low-ESR capacitor with a high capacitance value (e.g., 10uF to 22uF) and a voltage rating that exceeds the output voltage is recommended.
UCC29002DGK datasheet
by Texas Instruments
