TI recommends a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern under the device to improve thermal performance. A minimum of 2 oz copper thickness is recommended.
To ensure accurate current sensing, use a low-impedance current sense resistor (CSR) and place it close to the device. Also, ensure the PCB layout is designed to minimize noise and parasitic inductance.
The maximum allowed voltage on the VDD pin is 5.5V. Exceeding this voltage may damage the device.
Use the TI Fusion Digital Power Designer software to configure the UCD7138 for your specific application. The software provides a graphical user interface to customize the device's settings and generate configuration files.
The EN (Enable) pin is used to enable or disable the device. Tie the EN pin to VDD to enable the device or to GND to disable it. Use a pull-up resistor to ensure the pin is not left floating.