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    Part Img UCD9080RHBR datasheet by Texas Instruments

    • UCD9080 - Power Supply Sequencer and Monitor 32-VQFN -40 to 85
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
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    UCD9080RHBR datasheet preview

    UCD9080RHBR Frequently Asked Questions (FAQs)

    • Texas Instruments provides a recommended PCB layout in the UCD9080RHBR Evaluation Module User's Guide (SLUUAC5) and the UCD9080RHBR Design Checklist (SLUUAC6). These resources provide guidance on component placement, routing, and thermal management to ensure optimal performance and reliability.
    • The UCD9080RHBR is a highly configurable device, and configuration is typically done using the Fusion Digital Power Designer software. This software provides a graphical user interface for configuring the device's registers, setting up the power stages, and monitoring performance. Texas Instruments also provides application notes and design guides for specific use cases, such as telecom and data center power supplies.
    • The UCD9080RHBR has an operating temperature range of -40°C to 125°C, but the maximum junction temperature (TJ) is 150°C. It's essential to ensure proper thermal management, such as heat sinking and airflow, to maintain a safe operating temperature and prevent overheating.
    • The UCD9080RHBR is designed for isolated power supplies, but it can be used with non-isolated power supplies with some limitations. However, this requires careful consideration of the system's safety and regulatory requirements, as well as the potential for electrical noise and interference. Texas Instruments recommends using the device with an isolated power supply for optimal performance and reliability.
    • Texas Instruments provides a range of resources for troubleshooting, including the UCD9080RHBR Troubleshooting Guide (SLUUAC7) and the Fusion Digital Power Designer software. These resources provide guidance on identifying and resolving common issues, such as communication errors, power stage faults, and thermal management problems.
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